BSP296N optimos ? small-signal-transistor features ? n-channel ? enhancement mode ? logic level (4.5v rated) ? avalanche rated ? qualified according to aec q101 ? 100% lead-free; rohs compliant ? halogen-free according to iec61249-2-21 maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t a =25?c 1.2 a t a =70?c 0.9 pulsed drain current i d,pulse t a =25?c 4.6 avalanche energy, single pulse e as i d =1.2?a, r gs =25? w 15.0 mj reverse diode d v /d t d v /d t i d =1.2?a, v ds =80?v, d i /d t =200?a/s, t j,max =150?c 6 kv/s gate source voltage v gs 20 v power dissipation p tot t a =25?c w operating and storage temperature t j , t stg -55 ... 150 c esd class jesd22-a114 -hbm 0 (<250v) soldering temperature 260 c iec climatic category; din iec 68-1 55/150/56 value 1.8 pg - sot223 type package tape and reel information marking halogen - free packing BSP296N sot223 h6327: 1000 pcs/ reel BSP296N yes non dry v ds 100 v r ds(on),max v gs =10 v 0.6 w v gs =4.5 v 0.8 i d 1.2 a product summary rev 2.0 page 1 2013-04-04
BSP296N parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - soldering point r thjs - - 25 k/w thermal resistance r thja minimal footprint - - 110 junction - ambient 6 cm 2 cooling area 1) - - 70 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0?v, i d =250?a 100 - - v gate threshold voltage v gs(th) v ds =vgs?v, i d =100?a 0.8 1.4 1.8 drain-source leakage current i dss v ds =100?v, v gs =0?v, t j =25?c - - 0.1 m a v ds =100?v, v gs =0?v, t j =150?c - - 10 gate-source leakage current i gss v gs =20?v, v ds =0?v - - 10 na drain-source on-state resistance r ds(on) v gs =4.5?v, i d =0.95?a - 371 800 m w v gs =10?v, i d =1.2?a - 329 600 transconductance g fs | v ds |>2| i d | r ds(on)max , i d =0.9?a 2.66 - s values 1) device on 40mm x 40mm x 1.5mm epoxy pcb fr4 with 6cm2 (one layer, 70m thick) copper area for drain connection. pcb is vertical in still air. rev 2.0 page 2 2013-04-04
BSP296N parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance c iss - 114.8 152.7 pf output capacitance c oss - 19.7 26.3 reverse transfer capacitance c rss - 9.8 14.7 turn-on delay time t d(on) - 3.5 5.3 ns rise time t r - 3.8 5.7 turn-off delay time t d(off) - 18.4 27.6 fall time t f - 5.2 7.8 gate charge characteristics gate to source charge q gs - 0.27 0.4 nc gate to drain charge q gd - 1.45 2.2 gate charge total q g - 4.5 6.7 gate plateau voltage v plateau - 2.4 - v reverse diode diode continous forward current i s - - 1.2 a diode pulse current i s,pulse - - 4.6 diode forward voltage v sd v gs =0?v, i f =1.2?a, t j =25?c - 0.85 1.1 v reverse recovery time t rr - 27 40.5 ns reverse recovery charge q rr - 30 45 nc v r =50?v, i f =1.2?a, d i f /d t =100?a/s t a =25?c values v gs =0?v, v ds =25?v, f =1?mhz v dd =50?v, v gs =10?v, i d =1.2?a, r g,ext =6? w v dd =50?v, i d =1.2?a, v gs =0?to?10?v rev 2.0 page 3 2013-04-04
BSP296N 1 power dissipation 2 drain current p tot =f( t a ) i d =f( t a ); v gs 10 v 3 safe operating area 4 max. transient thermal impedance i d =f( v ds ); t a =25 c; d =0 z thja =f( t p ) parameter: t p parameter: d = t p / t single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 - 4 10 - 3 10 - 2 10 - 1 10 0 10 1 10 2 10 0 10 1 10 2 z thja [k/w] t p [s] 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 0 40 80 120 160 p tot [w] t a [ c] 0 0.25 0.5 0.75 1 1.25 0 40 80 120 160 i d [a] t a [ c] 1 s 10 s 100 s 1 ms 10 ms dc 0.001 0.01 0.1 1 10 1 10 100 1000 i d [a] v ds [v] rev 2.0 page 4 2013-04-04
BSP296N 5 typ. output characteristics 6 typ. drain-source on resistance i d =f( v ds ); t j =25 c r ds(on) =f( i d ); t j =25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. forward transconductance i d =f( v gs ); | v ds |>2| i d | r ds(on)max g fs =f( i d ); t j =25 c 0 1 2 3 4 5 6 0.0 0.8 1.6 2.4 3.2 4.0 4.8 g fs [s] i d [a] 25 c 150 c 0 0.8 1.6 2.4 3.2 4 4.8 0 1 2 3 4 i d [a] v gs [v] 2.8 v 3 v 3.3 v 3.5 v 4 v 4.5 v 10 v 0 250 500 750 1000 0 0.8 1.6 2.4 3.2 4 4.8 r ds(on) [mw] i d [a] 2.8 v 3 v 3.3 v 3.5 v 4 v 10 v 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 0 2 4 6 8 i d [a] v ds [v] rev 2.0 page 5 2013-04-04
BSP296N 9 drain-source on-state resistance 10 typ. gate threshold voltage r ds(on) =f( t j ); i d =1.2 a; v gs =10 v v gs(th) =f( t j ); v ds =v gs ; i d =100 a parameter: i d 11 typ. capacitances 12 forward characteristics of reverse diode c =f( v ds ); v gs =0 v; f =1 mhz; t j =25c i f =f( v sd ) parameter: t j typ max 0 200 400 600 800 1000 1200 1400 - 60 - 40 - 20 0 20 40 60 80 100 120 140 160 r ds(on) [mw] t j [ c] 0 0.4 0.8 1.2 1.6 2 2.4 - 60 - 10 40 90 140 v gs(th) [v] t j [ c] ciss coss crss 10 0 10 1 10 2 10 3 0 10 20 30 40 50 60 70 80 90 100 c [pf] v ds [v] 25 c 150 c 25 c, 98% 150 c, 98% 10 - 2 10 - 1 10 0 10 1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 i f [a] v sd [v] typ max min rev 2.0 page 6 2013-04-04
BSP296N 13 avalanche characteristics 14 typ. gate charge i as =f( t av ); r gs =25 w v gs =f( q gate ); i d =1.2 a pulsed parameter: t j(start) parameter: v dd 15 drain-source breakdown voltage 16 gate charge waveforms v br(dss) =f( t j ); i d =250 a 80 84 88 92 96 100 104 108 112 116 120 - 60 - 20 20 60 100 140 180 v br(dss) [v] t j [ c] 20 v 50 v 80 v 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 v gs [v] q gate [nc] 25 c 100 c 125 c 10 0 10 1 10 2 10 3 10 - 1 10 0 10 1 i av [a] t av [s] rev 2.0 page 7 2013-04-04 v gs q gate v gs(th) q g(th) q gs q gd q sw q g
BSP296N sot223 package outline: footprint: packaging: dimensions in mm rev 2.0 page 8 2013-04-04
BSP296N published by infineon technologies ag 81726 munich, germany ? 2011 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev 2.0 page 9 2013-04-04
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